| Wafer size | 200,300mm |
|---|---|
| Contact Accuracy | ±1.5μm |
| Z-Force | 200 kgf/400 kgf |
| Temperature range | -40°C ~ +150°C |
| Docking mode | Hinge or Direct docking |
|
국내담당자(Domestic Manager)
|
정진교 상무 | jinkyo.jung@techwing.co.kr |
|
해외담당자(Global Manager)
|
Director JinKyo.Jung | jinkyo.jung@techwing.co.kr |
