| Target Package | BGA, TSOP, CSP, MCP, POP, etc. |
|---|---|
| Parallelism | Up to 768 |
| Throughput | Up to 36,500 |
| Temperature range | -40℃ to +125℃ -55℃ to +150℃ (Option) |
| Docking mode | Vertical docking |
|
국내담당자(Domestic Manager)
|
전현준 상무 | june.jeon@techwing.co.kr |
| 구본철 부장 | bonchul.ku@techwing.co.kr | |
|
해외담당자(Global Manager)
|
Director Bon Kim | bon.kim@techwing.co.kr |
| - |
