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TWP300SN
Specification
| Wafer size | 200,300mm |
|---|---|
| Contact Accuracy | ±1.5μm |
| Z-Force | 200 kgf/400 kgf |
| Temperature range | -40°C ~ +150°C |
| Docking mode | Hinge or Direct docking |
Details
|
Domestic Manager
|
Director HyunJune, Jeon | june.jeon@techwing.co.kr |
|
Global Manager
|
Director JinKyo, Jung | jinkyo.jung@techwing.co.kr |
