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TW350HT
Specification
Target Package BGA, TSOP, CSP, MCP, POP, etc.
Parallelism Up to 512
Throughput Up to 46,000
Temperature range -40℃ to +125℃
-55℃ to +150℃ (Option)
Docking mode Vertical docking
Details
1. Memory, Module, Interface board

  Director 
  Bon kim
  (+82-31-379-8088)
  bon.kim@techwing.co.kr

2. Logic

  General  Manager
  Sean Park
  (+82-31-379-8021)
  sean.park@techwing.co.kr