| Target Device | Die Level Test (HBM) |
|---|---|
| Parallelism | 256para |
| Contact Accuracy | ±5μm |
| Stage | Dual Chuck |
| Temperature range | -40°C ~ +150°C | Docking mode | Hinge or Direct docking |
|
국내담당자(Domestic Manager)
|
전현준 상무 | june.jeon@techwing.co.kr |
|
해외담당자(Global Manager)
|
Director Bon Kim | bon.kim@techwing.co.kr |
