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TWHBM300N
Specification
| Target Device | Die Level Test (HBM) |
|---|---|
| Parallelism | 256para |
| Contact Accuracy | ±5μm |
| Stage | Dual Chuck |
| Temperature range | -40°C ~ +150°C | Docking mode | Hinge or Direct docking |
Details
|
Domestic Manager
|
Director JinKyo.jung | jinkyo.jung@techwing.co.kr |
|
Global Manager
|
Director Bon Kim | bon.kim@techwing.co.kr |
