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TW154T
Specification
Target Package BGA, TSOP, CSP, QFP, DIP, etc.
Parallelism Up to 16/32
Throughput Up to 15,000
Temperature range -45 to 155℃
Docking mode Horizontal docking
Details
1. Memory, Module, Interface board

  Director 
  Bon kim
  (+82-31-379-8088)
  bon.kim@techwing.co.kr


2. Logic

  General  Manager
  Sean Park
  (+82-31-379-8021)
  sean.park@techwing.co.kr