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TW-S7
Specification
| Target Package | BGA, TSOP, CSP, MCP, POP, etc. |
|---|---|
| Parallelism | Up to 768 |
| Throughput | Up to 36,500 |
| Temperature range | -40℃ to +125℃ -55℃ to +150℃ (Option) |
| Docking mode | Vertical docking |
Details
1. Memory, Module, Interface board
Director
Bon kim
(+82-31-379-8088)
bon.kim@techwing.co.kr
2. Logic
Director
Bon kim
(+82-31-379-8088)
bon.kim@techwing.co.kr
Director
Bon kim
(+82-31-379-8088)
bon.kim@techwing.co.kr
2. Logic
Director
Bon kim
(+82-31-379-8088)
bon.kim@techwing.co.kr
